Journal

[4] Simulation of the copper diffusion profile in SiO2 during bias temperature stress (BTS) test

Author

Jang-Yeon Kwon, Ki-Su KIM, Young-Chang JOO and Ki-Bum KIM

Journal

Japanese Journal of Applied Physics
Jpn. J. Appl. Phys.

Vol / Page / Year

41 / L99 / 2002